Recent Trend of Reliability Technology. Estimation of Strength Reliability of Surface Mount Solder Joints.
نویسندگان
چکیده
منابع مشابه
Solder Joints in Electronics: Design for Reliability
The emerging new technologies provide ever more challenges to assure the reliability of electronic products. The ever increasing demands in electronic products for higher performance, lower cost, less space (weight) is leading to ever denser interconnection needs. This makes solder joint reliability an even more important issue with the advent of new surface mount packages and the use of surfac...
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A novel and direct method to measure the stress-strain properties of surface mount solder joints is proposed in this paper. The specimen used in the experiments is a quad flat pack (QFP)-solder-printed circuit board (PCB) assembly and the fabrication of solder joints makes use of conventional surface mount technology (SMT). Mechanical cycling and thermal shock testing can be conducted directly ...
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ژورنال
عنوان ژورنال: The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
سال: 1997
ISSN: 1884-1201,1341-0571
DOI: 10.5104/jiep1995.12.384